SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 24576010 is a complete, unshielded chassis case belonging to the EuropacPRO series. It features a 3U rack unit height and an 84HP horizontal pitch. The enclosure depth is specified as 326mm. Constructed from aluminum with a natural color finish, it serves as a structural housing for electronic modules. The product complies with RoHS standards.
Verify the exact depth specification against project requirements, as datasheets may list variations such as 326mm or 235mm depending on specific sub-variants within the EuropacPRO line. Confirm that the unshielded nature of the chassis meets electromagnetic compatibility needs. Ensure the 3U height and 84HP width align with the intended internal component layout before ordering.
Select this model when a complete, pre-assembled chassis is required rather than individual frame components. The 3U form factor suits compact installations where vertical space is limited. The unshielded design is appropriate for environments where external shielding is not critical or will be provided separately. Verify compatibility with standard 19-inch rack systems.
This component is part of the nVent SCHROFF EuropacPRO series, a widely used line of modular rack systems. The 24576010 designation specifically identifies a complete case configuration. Similar parts in the series include variants with different depths or shielded options, such as the 24576008 or 24576011, allowing for customization based on specific thermal or EMC requirements.
Direct substitutes within the same family include other complete cases like 24576008 or 24576011. When replacing, ensure the new part matches the 3U height and 84HP width constraints. Depth differences between variants must be evaluated to guarantee fitment of internal hardware.
TOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read More