SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 24576048 is a rear panel component belonging to the EuropacPRO series. It features a height of 3U and a horizontal pitch of 42 HP. The unit is designed as an unshielded, unvented panel with full width dimensions. Constructed for rack mounting applications, it serves as a structural backplane element within electronic packaging systems.
Verify the specific model number against official nVent SCHROFF documentation to confirm the 3U height and 42 HP pitch specifications. Ensure the unshielded and unvented characteristics align with the project's thermal and electromagnetic requirements before procurement.
Select this part when a solid, non-perforated rear surface is required for a 3U rack position. Confirm compatibility with the EuropacPRO series mounting standards. Evaluate if the lack of shielding meets environmental safety protocols.
This component is part of the EuropacPRO product line by nVent SCHROFF, specializing in standardized electronic packaging solutions. It functions as a complementary accessory to chassis and enclosure systems, ensuring consistent dimensional alignment within modular rack architectures.
Consult official nVent SCHROFF substitution guides for verified equivalents. Generic rack panels may not match the precise 42 HP pitch or 3U height tolerances required for EuropacPRO integration.

Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More