SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 24813864 is a PIU S2 GR EMC plug-in unit designed for 6U rack systems. It features a 14HP horizontal mounting profile and a depth of 227mm. This component serves as a ventilated backplane or interface module within industrial enclosure architectures, facilitating signal distribution and power routing for mounted electronic cards.
Verify the exact dimensional tolerances against your specific chassis requirements before integration. Confirm that the 227mm depth aligns with your enclosure's rear clearance. Ensure the 14HP width matches your card layout needs. Cross-reference the datasheet for mounting hole patterns to guarantee mechanical compatibility with your existing rack structure.
Select this unit when a dedicated EMC-shielded interface is required for 6U modules. The 227mm depth offers a compact solution compared to deeper alternatives. Consider the ventilated design if passive cooling is sufficient for your load. Evaluate the 14HP width against the number of slots needed for your specific application density.
This part belongs to the nVent SCHROFF PIU S2 series, which focuses on standardized rack accessories. The S2 designation typically indicates a specific generation of plug-in units optimized for modern industrial enclosures. It complements other Schroff rack components to form complete system solutions.
Direct substitutes may include variants with different depths such as 167mm or 227mm equivalents from the same series. Verify that any replacement maintains the 6U height and 14HP width constraints. Check for identical EMC performance ratings and mounting interfaces.

Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read More
WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More