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24AA128T-I/MNY is listed in the Memory IC range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC EEPROM 128KBIT I2C 8TDFN. Review the specifications below when checking this part for your BOM.
The Microchip Technology 24AA128T-I/MNY is a 128 Kbit (16K x 8) Serial Electrically Erasable PROM (EEPROM). It operates on a single supply voltage ranging from 1.7V to 5.5V and supports I2C compatible two-wire serial interface communication with clock frequencies up to 400 kHz. The device features hardware write protection, Schmitt trigger inputs for noise suppression, and output slope control to eliminate ground bounce. It offers high endurance exceeding one million erase/write cycles and data retention of over 200 years.
Verify that the ordering suffix 'I' corresponds to the Industrial temperature range (-40°C to +85°C) and 'MNY' matches the specific 8-ball CSP package configuration. Confirm the device meets RoHS compliance requirements for your assembly process. Ensure the selected variant aligns with the required voltage range and interface speed specifications for your system design.
Select this component when a 128 Kbit EEPROM with a broad voltage operating range is required. The Industrial temperature grade ensures reliability in demanding environments. Consider the 8-ball CSP package for space-constrained designs. Verify that the 400 kHz maximum clock frequency meets the system's data transfer rate needs.
This part belongs to the 24XX128 family of Serial EEPROMs, which includes variants like the 24LC128 and 24FC128. These devices share similar functional characteristics but differ in voltage ranges and maximum clock speeds. The 24AA128 specifically supports operation down to 1.7V, making it suitable for low-voltage applications compared to other family members.
The 24LC128 and 24FC128 are functionally compatible within the same family. However, verify voltage range compatibility as the 24LC128 requires a minimum of 2.5V. The 24FC128 supports higher clock speeds up to 1 MHz. Ensure the replacement package type matches the PCB footprint requirements.
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