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24LC02BH-E/ST is listed in the Memory IC range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC EEPROM 2KBIT I2C 8TSSOP. Review the specifications below when checking this part for your BOM.
The Microchip Technology 24LC02BH-E/ST is a 2 Kbit (256 x 8) serial EEPROM featuring an I2C-compatible two-wire interface. It operates on a single supply voltage ranging from 2.5V to 5.5V and supports clock frequencies up to 400 kHz. The device includes hardware write protection for the upper half of the memory array (addresses 80h-FFh) via the WP pin. It utilizes low-power CMOS technology with a maximum read current of 1 mA and standby current of 1 µA. The component is housed in an 8-lead TSSOP package and is rated for extended industrial temperature operation from -40°C to +125°C.
Verify that the ordering suffix corresponds to the TSSOP-8 package type and Extended temperature grade. Confirm the specific revision level matches the design requirements, as datasheet revisions may update electrical characteristics or packaging dimensions. Ensure compatibility with the system's I2C bus voltage levels and pull-up resistor configurations before finalizing procurement.
Select this component when a 2 Kbit non-volatile memory solution is required with hardware-level write protection for critical data segments. It is suitable for designs operating within the 2.5V to 5.5V range where low standby power consumption is necessary. The extended temperature rating makes it appropriate for harsh industrial environments compared to standard commercial grade alternatives.
This part belongs to the 24XX02H family of serial EEPROMs, which share a common architecture but differ in voltage ranges and temperature grades. The 'L' designation indicates low-voltage operation starting at 1.7V, while 'C' denotes standard commercial voltage starting at 2.5V. The 'E' suffix specifies the extended temperature range, distinguishing it from the industrial 'I' grade variant.
The 24LC02B series serves as a functional substitute, offering identical memory organization and interface protocols. When replacing, verify that the alternative part meets the required extended temperature specifications and physical package dimensions to ensure mechanical compatibility.
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