24LC08BHT-I/OT

Memory IC Overview

The Microchip Technology 24LC08BHT-I/OT is an 8 Kbit (1 k x 8) serial EEPROM utilizing a 2-Wire I2C compatible interface. It operates within a voltage range of 2.5 V to 5.5 V and supports a maximum clock frequency of 400 kHz. The device features a 900 ns access time, 3 mA active read current, and 1 µA standby current. It is housed in a 5-lead SOT-23 package with an industrial temperature rating of -40°C to +85°C.

Memory IC Feature Summary

• Hardware write-protect capability for the upper half of the memory array via the WP pin
• Schmitt trigger inputs and noise filtering on SDA and SCL lines for improved signal integrity
• Self-timed erase/write cycles with automatic page write buffer management

Memory IC Applications

• Industrial control systems requiring non-volatile data storage
• Embedded devices needing configuration parameter retention
• Low-power consumer electronics operating at 2.5V or higher

Memory IC Procurement Notes

Verify that the specific ordering suffix matches the required temperature grade and package type. Confirm the manufacturer part number against official Microchip documentation to ensure compatibility with system voltage levels and interface requirements before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a compact surface-mount solution is required for small capacity data logging. The SOT-23-5 package offers space efficiency compared to standard 8-pin packages. Ensure the application environment remains within the specified industrial temperature range and supply voltage limits.

Memory IC Part Context

This device belongs to the 24XX08H family of 8-Kbit serial EEPROMs from Microchip Technology. It shares functional characteristics with other variants in the series but is distinguished by its specific industrial temperature rating and SOT-23-5 packaging configuration.

Memory IC Replacement Considerations

Direct replacements include other 24LC08BH variants such as 24LC08BHT-I/ST or 24LC08BHT-I/MS, provided the package footprint difference is accommodated in the design.