SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff model 28230033 is a standard 19-inch rack frame designed for electronic equipment mounting. It features a height of 38 U, providing substantial vertical space for module installation. The physical dimensions are specified as 553 mm in width and 500 mm in depth. This component serves as the structural enclosure for subracks and backplane systems.
Verify the exact dimensional tolerances against your specific chassis requirements before ordering. Confirm that the 500 mm depth aligns with your internal component layout. Ensure compatibility with standard 19-inch rail systems. Check for any specific finish or material specifications required by your application environment to guarantee proper fit and function.
Select this frame when a robust 38 U enclosure is required for dense module arrangements. Consider the 500 mm depth constraint relative to your deepest components. Evaluate if the standard 19-inch width matches your existing system architecture. Compare against alternative depths if space constraints are critical for your specific deployment scenario.
This part belongs to the nVent SCHROFF line of electronics packaging solutions. The brand specializes in modular rack systems, cabinets, and accessories for industrial applications. These products are engineered for scalability and reliability in demanding electronic environments, supporting various industry standards for equipment mounting.
No public confirmed substitute part numbers are available in the provided documentation. Verify compatibility with existing rails and backplanes if considering alternative manufacturers. Ensure replacement frames meet identical 19-inch width and 38 U height specifications.
NXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More