3-1470213-0

Headers, Male Pins Overview

The 3-1470213-0 is a vertical header connector from the AMPMODU 2MM series, manufactured by TE Connectivity AMP Connectors. It features a 30-position configuration arranged in two rows with a 2.00mm (0.079 inch) mating pitch. The contacts are male pins designed for through-hole termination. This component is intended for board-to-board or cable connections within rectangular connector systems.

Headers, Male Pins Feature Summary

• Vertical orientation design for standard mounting applications
• Dual-row configuration providing high-density connectivity
• Male pin contact type ensuring secure mating interface

Headers, Male Pins Applications

• Board-to-board interconnections
• Cable-to-board wiring assemblies
• General electronic equipment signal routing

Headers, Male Pins Procurement Notes

Verify the specific suffix and packaging format against the official datasheet to ensure compatibility with automated assembly processes. Confirm that the terminal plating and insulation material meet the environmental requirements of the target application before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a 2.00mm pitch is required for compact circuit layouts. Ensure the mating connector matches the dual-row female socket specification. Validate that the through-hole footprint aligns with the PCB manufacturing capabilities and thermal profile constraints.

Headers, Male Pins Part Context

This part belongs to the AMPMODU 2MM family, which provides versatile solutions for dense interconnect needs. The series supports various row counts and contact configurations, making it suitable for diverse industrial and commercial electronics where space efficiency and reliable signal transmission are critical.

Headers, Male Pins Replacement Considerations

Direct substitutes must maintain the 2.00mm pitch, 30-position count, and dual-row male header configuration. Verify mechanical dimensions and terminal plating specifications to ensure functional interchangeability without redesigning the host PCB.