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302-050-658-201 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is 302 SERIES (.05" (1.27MM) CONTAC. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 302-050-658-201 is a dual-edge card edge connector from the 302 series, designed for board-edge mounting. It features 50 positions with female contacts arranged in two rows. The connector utilizes a 0.050 inch (1.27mm) pitch and supports PCB thicknesses ranging from 0.051 to 0.071 inches (1.30mm to 1.80mm). Contacts are made of copper alloy with gold plating and employ a cantilever spring design. The housing is black polyamide (PA66), rated for operation between -55°C and 85°C.
Verify that the target printed circuit board thickness falls strictly within the 0.051 to 0.071 inch specification to ensure proper mechanical retention and electrical contact. Confirm that the application environment remains within the -55°C to 85°C operational limits. Ensure compatibility with the 0.050 inch pitch requirement for both the connector footprint and the mating card edge layout.
Select this component when a low-profile, dual-edge connection is required for thin circuit boards. The 0.050 inch pitch allows for high-density signal routing compared to larger pitch alternatives. The cantilever contact type simplifies assembly by eliminating the need for complex card-edge plating processes on the mating substrate.
This part belongs to the EDAC 302 series, which specializes in low-profile card edge connectors. The series is characterized by its use of cantilever contacts and suitability for applications requiring robust connections on relatively thin substrates. It serves as a standard solution for modular electronic systems where frequent insertion or removal may be necessary.
No public confirmed substitute part numbers are available in the provided documentation. Cross-referencing requires matching the 0.050 inch pitch, dual-edge configuration, and 50-position count precisely.
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