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305-016-556-207 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 16POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-016-556-207 is a standard card edge connector from the 305 series, designed for dual-edge board insertion. It features 16 positions with a 3.96 mm (0.156 inch) pitch and supports PCB thicknesses between 1.37 mm and 1.78 mm. The component utilizes copper alloy contacts with gold plating and employs a solder pin termination method. Rated for 5 A current, it operates within a temperature range of -40°C to +105°C.
Verify the specific ordering suffix against official EDAC documentation to confirm contact configuration and flange characteristics. Ensure compatibility with target PCB thickness specifications before procurement. Confirm RoHS compliance status through manufacturer datasheets. Validate that the selected variant matches the required panel mounting style and terminal type for the intended assembly process.
Select this component when a dual-edge card interface with a 3.96 mm pitch is required. Consider the 5 A current rating and -40°C to +105°C operating range for environmental suitability. Evaluate the panel mount style against available chassis space. Verify that the 16-position count aligns with circuit requirements and that the solder pin termination method fits the manufacturing workflow.
This part belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and mounting options while maintaining consistent electrical and mechanical standards. Components in this family are engineered for robust performance in industrial and commercial electronic applications requiring reliable interconnect solutions.
Consult the EDAC 305 Series Ordering Guide for verified substitute part numbers. Cross-reference position counts, pitch dimensions, and termination types to ensure functional equivalence. Verify that alternative components meet identical thermal and current ratings.
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