305-018-556-512

Edgeboard Connectors Overview

The EDAC 305-018-556-512 is a standard card edge connector header featuring 18 positions with a 3.96 mm pitch and dual-row configuration. Designed for vertical panel mount installation, it utilizes gold-plated copper alloy contacts and solder pin termination. The unit accommodates a nominal PCB thickness of 1.57 mm and operates within a temperature range of -40°C to +105°C.

Edgeboard Connectors Feature Summary

• Dual-edge female contact design for secure board insertion
• Low-profile thermoplastic insulator body construction
• Gold-plated copper alloy contacts for reliable conductivity

Edgeboard Connectors Applications

• Board-to-board interconnection systems
• Industrial control panel mounting
• Electronic module expansion slots

Edgeboard Connectors Procurement Notes

Verify the specific suffix against official EDAC documentation to confirm exact plating thickness and material specifications. Ensure compatibility with the target PCB thickness of 1.57 mm before integration. Confirm that the vertical panel mount style aligns with the mechanical enclosure requirements.

Edgeboard Connectors Selection Notes

Select this component when a dual-row, 18-position connection is required with a 3.96 mm spacing. It is suitable for applications demanding vertical orientation and robust thermal performance up to 105°C. Verify that the solder pin termination method matches the assembly process capabilities.

Edgeboard Connectors Part Context

This part belongs to the EDAC 305 Series, which provides standard card edge connectors. The series offers various position counts and row configurations while maintaining consistent 3.96 mm pitch dimensions. These headers are engineered for general-purpose electronic interconnects requiring durable mechanical and electrical performance.

Edgeboard Connectors Replacement Considerations

Cross-reference similar 18-position, 3.96 mm pitch dual-row headers from other manufacturers. Ensure identical panel mount orientation and solder pin termination styles are maintained during substitution.