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305-020-521-268 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 20POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-020-521-268 is a standard card edge connector from the 305 Series, designed for dual-edge board applications. It features a 20-position configuration with a 3.96 mm (0.156 inch) pitch and supports a maximum board thickness of 1.57 mm. The connector utilizes gold-plated copper alloy contacts to ensure reliable signal transmission and includes a green thermoplastic polyester housing. Rated for 5 A current, it offers an insulation resistance of 5 GOhms and operates within a temperature range of -40°C to +105°C.
Verify the specific suffix codes against the manufacturer's official documentation to confirm exact plating thickness, material composition, and mounting style variations. Ensure compatibility with the target PCB edge profile and thickness specifications before procurement to prevent mechanical fit issues or electrical performance degradation in final assembly.
Select this component when a dual-row, vertical panel-mount solution is required for double-sided circuit boards. The 3.96 mm pitch accommodates standard industrial board designs, while the 5 A rating suits moderate power distribution needs. Confirm that the application environment remains within the specified -40°C to +105°C operational limits to maintain insulation integrity.
This part belongs to the EDAC 305 Series, which provides a range of standard card edge connectors. The series offers various position counts and mounting styles, allowing engineers to scale connectivity solutions across different product lines while maintaining consistent interface dimensions and electrical characteristics for modular design approaches.
Cross-reference with other EDAC 305 Series variants sharing identical pitch and row configurations. Verify that substitute parts match the 20-position count, vertical orientation, and dual-edge acceptance requirements to ensure mechanical and electrical interchangeability without redesigning the host PCB footprint.
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