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305-028-555-278 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 28POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-028-555-278 is a standard card edge connector from the 305 series, featuring a dual-row configuration with 28 positions. It utilizes a 3.96 mm (0.156 inch) contact pitch and accommodates printed circuit boards with a nominal thickness of 1.57 mm. The component employs gold-plated copper alloy contacts for reliable signal transmission and thermoplastic insulation. Designed for panel mounting in a vertical orientation, it supports solder lug termination. The connector operates within a temperature range of -40°C to +105°C and maintains an insulation resistance of 5 GOhms.
Verify the specific ordering suffix against official EDAC documentation to confirm exact physical dimensions and termination style. Confirm RoHS compliance status through current manufacturer declarations. Ensure compatibility with target PCB thickness specifications before procurement. Cross-reference part numbers with authorized distributors to validate supply chain authenticity.
Select this component when a vertical, panel-mount solution is required for dual-edge card applications. The 3.96 mm pitch suits spacing requirements for high-density interconnects. Verify that the target system environment remains within the specified operating temperature limits. Ensure mechanical constraints allow for the designated panel mounting style and solder lug termination method.
This connector belongs to the EDAC 305 series, which offers various position counts and mounting options. The series is characterized by standardized spacing and robust construction suitable for demanding environments. Related models in this family share similar dimensional profiles but differ in contact count and specific mounting configurations.
Direct substitutes include other EDAC 305 series variants with matching 28-position dual-row layouts. Verify identical pitch and board thickness compatibility when considering alternative manufacturers. Ensure equivalent termination styles and mounting orientations are maintained.
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