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305-038-556-268 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 38POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-038-556-268 is a standard card edge connector from the 305 series, designed for dual-row applications with 38 positions. It features a contact spacing of 0.156 inches (3.96 mm) and a row spacing of 0.140 inches (3.56 mm). The connector accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). Constructed with copper alloy contacts that are gold-plated, it ensures reliable electrical performance. The unit utilizes a solder pin termination type and is intended for panel mounting in a vertical orientation.
Verify the specific suffix codes against the manufacturer's ordering guide to ensure correct flange and termination options. Confirm RoHS compliance status and environmental ratings prior to integration. Cross-reference the datasheet for mechanical dimensions to validate panel cutout requirements. Ensure compatibility with existing board thickness specifications.
Select this component when a dual-row card edge interface is required for panel mounting. The 3.96 mm pitch suits applications needing robust connections with moderate pin counts. Verify that the target PCB thickness aligns with the 0.062-inch specification. Consider the vertical mounting style for space-constrained chassis designs.
This part belongs to the EDAC 305 series of card edge connectors, which offers various mounting styles and position counts. The series is characterized by its standardized 3.96 mm pitch and durable construction suitable for industrial environments. It serves as a reliable interface between flexible or rigid PCBs and system backplanes.
Direct substitutes within the same series include parts like 305-038-556-258 or 305-038-556-212, depending on specific flange or termination variations. Always verify mechanical fit and electrical ratings before swapping components.
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