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305-040-520-558 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 40POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-040-520-558 is a standard card edge connector featuring 40 positions arranged in a dual-row configuration. It utilizes a 3.96 mm (0.156 inch) contact spacing with a row spacing of 3.56 mm (0.140 inch). Designed for panel mount installation via through-hole solder termination, the component accepts printed circuit boards with a nominal thickness of 1.57 mm (0.062 inch). The contacts are constructed from copper alloy and finished with gold plating to ensure reliable conductivity. The housing is made of green thermoplastic material.
Verify that the specific part number matches the required 40-position dual-row configuration before ordering. Confirm compatibility with the target PCB thickness of 1.57 mm to ensure proper mechanical fit. Check regional availability as distribution status may vary by location. Ensure that the panel mount style aligns with the intended assembly requirements. Validate insulation resistance and current rating specifications against the application's electrical demands.
Select this connector when a dual-row interface with 3.96 mm spacing is required for robust panel-mounted applications. The gold-plated contacts provide superior corrosion resistance compared to tin finishes. Consider the low-profile body if vertical space constraints exist within the enclosure. Verify that the polarizing key acceptance feature meets the system's orientation security needs. Ensure the thermoplastic housing material is suitable for the operating temperature range.
This component belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and termination styles to support diverse electronic assembly needs. The 305 series is characterized by its reliable copper alloy contact construction and standardized spacing dimensions. It serves as a fundamental interconnection solution for modular electronic systems requiring stable physical and electrical connections.
Compatible substitutes include other EDAC 305 series variants with matching 40-position dual-row layouts. Verify that alternative parts maintain the 3.96 mm pitch and 1.57 mm board thickness tolerance. Ensure replacement components support the same panel mount and through-hole solder termination methods.
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