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305-066-520-202 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 66POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-066-520-202 is a standard card edge connector from the 305 Series, designed for vertical panel mounting applications. It features a dual female configuration with 66 positions and a 0.156-inch (3.96 mm) pitch. The connector utilizes gold-plated copper alloy contacts housed in a green thermoplastic insulator. It supports solder pin termination and accommodates board thicknesses ranging from 0.054 to 0.070 inches. The component operates within a temperature range of -40°C to +105°C.
Verify the specific ordering suffix against the manufacturer's current datasheet to ensure compatibility with required flange styles and termination types. Confirm that the selected variant matches the intended PCB thickness and mounting orientation requirements for your specific assembly process.
Select this connector when a high-density, dual-row interface is required for vertical panel integration. Ensure the mating card edge thickness falls within the specified 0.054 to 0.070-inch range. Verify that the 0.156-inch pitch aligns with the target PCB layout constraints and that the operating temperature environment remains within the -40°C to +105°C specification.
This component belongs to the EDAC 305 Series, which offers a wide range of standard card edge connectors. The series provides various position counts and mounting options to suit diverse electronic interconnection needs. The 305-066-520-202 specifically addresses applications requiring a 66-position dual-row interface with robust mechanical stability.
Consult the official EDAC 305 Series ordering guide for direct substitutes with differing position counts or flange configurations. Cross-reference compatible parts based on identical pitch, row count, and termination style to maintain mechanical and electrical continuity.
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