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305-070-555-507 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 70POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-070-555-507 is a standard card edge connector from the 305 series, designed for dual-edge board applications. It features 70 positions with a contact spacing of 3.96 mm and a row spacing of 3.56 mm. The connector accepts printed circuit boards with a nominal thickness of 1.57 mm. Electrical specifications include a current rating of 5 amps and a maximum contact resistance of 10 milliohms. The insulator body is green thermoplastic, operating within a temperature range of -40°C to +105°C.
Verify the specific suffix code against official EDAC documentation to confirm exact plating and termination variations. Ensure compatibility with the target PCB thickness of 1.57 mm before integration. Confirm that the 70-position layout matches the required signal routing density. Check regional availability as distribution may be restricted in certain locations.
Select this component when a dual-row, 70-position interface is required for 1.57 mm thick boards. The 3.96 mm pitch suits applications needing wider spacing than standard 2.54 mm connectors. Consider the gold-tin plating combination for reliable signal integrity and solderability. Verify that the vertical panel mount style fits the enclosure constraints.
This part belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and mounting options while maintaining consistent 3.96 mm pitch characteristics. The 305-070-555-507 specifically addresses high-density dual-edge requirements within this family.
Cross-reference with other 305 series variants such as 305-070-556-568 for similar positioning but different termination styles. Ensure mechanical fitment with existing panel cutouts and PCB slots before substitution.
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