SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 30809667 is a black HF body tube designed for use with HF frame type plug-in units. It serves as a housing for the insertion of PCBs within cassette systems. The component belongs to the 30809 Series and is supplied in packs of five pieces. It is specifically engineered to provide structural support and enclosure for electronic modules in rack-mounted applications.
Verify the manufacturer part number 30809667 against official nVent SCHROFF documentation to confirm compatibility with specific HF frame types. Ensure the required quantity matches the standard pack size of five pieces per unit. Cross-reference technical datasheets for dimensional accuracy before integration into existing rack structures.
Select this component when integrating PCBs into HF frame type plug-in units requiring a dedicated housing. Confirm that the application utilizes cassette-style mounting systems compatible with the 30809 Series. Verify that the black finish meets aesthetic or environmental requirements for the specific installation environment.
This component is part of the nVent SCHROFF 30809 Series, which provides accessories for modular rack systems. It functions as a specialized body tube rather than a standalone enclosure, intended to house printed circuit boards within larger frame assemblies. The series supports standardized industrial electronics mounting solutions.
No public confirmed substitute part numbers are available for direct replacement.

Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More