SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 30847602 is a static front panel designed for use with the SBG 3HE and 3TE series enclosures. Constructed from aluminum, the component features a front anodized finish and a conductive rear side to ensure proper grounding within the assembly. The panel dimensions are specified as 3U height by 3HP width, with a thickness of 2.5 mm. It is engineered to accommodate a static trapezoid handle, providing a secure interface for equipment integration in standard rack environments.
Verify that the required handle type matches the static trapezoid specification before procurement. Confirm compatibility with the specific SBG 3HE or 3TE enclosure model in use. Ensure the application environment does not require shielding, as this unit is unshielded. Check lead time requirements against project schedules due to potential manufacturing delays.
Select this part when a non-shielded front panel is required for 3U x 3HP openings in Schroff SBG series cabinets. Choose this aluminum variant over steel if weight reduction or specific thermal conductivity is preferred. Ensure the design calls for a conductive back surface to maintain electrical continuity in the rack structure.
This component belongs to the nVent SCHROFF line of electronics packaging solutions. It serves as a modular accessory for their combinable and scalable rack systems. The product supports the standardization of front panels across various enclosure models, facilitating uniform appearance and mechanical stability in industrial IT and telecommunications infrastructure.
No direct substitute part numbers are publicly confirmed for this specific configuration. Verify dimensional compatibility if considering alternative manufacturers. Ensure any replacement maintains the 3U x 3HP footprint and conductive rear requirement.
May 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More