SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF 30848431 is a plug-in unit U-profile front panel designed for IEL and IET series enclosures, specifically Type 2 and Type 3 configurations. It features a 10 HP (Housing Unit) width with a 0.1-inch offset and a thickness of 2.5 mm. Constructed from aluminum, the component offers a front anodized finish and a rear conductive surface to support grounding requirements. The unit includes a type 2 handle in trapezoid form, ensuring secure mounting and operational access within standard 19-inch rack systems.
Verify that the target enclosure system matches the specified IEL or IET series compatibility. Confirm that the required housing unit width aligns with the 10 HP specification to ensure proper fitment. Ensure that the installation environment supports the use of aluminum components with anodized finishes. Check that the rear conductive surface requirement is met by the intended grounding scheme. Validate that the type 2 handle configuration meets the operational needs of the assembly.
Select this component when a dedicated front panel is required for IEL or IET series units. Choose this part if a 10 HP width is necessary for the specific module layout. Opt for this model when a conductive rear surface is mandated for shielding purposes. Consider this option if the type 2 trapezoid handle style is preferred for user interaction. Ensure the 2.5 mm thickness aligns with the mechanical constraints of the existing rack structure.
This component belongs to the nVent SCHROFF range of electronics packaging solutions. It serves as a structural and functional interface element for modular rack systems. The product line focuses on providing standardized, high-quality components for industrial electronics enclosures. As a plug-in unit, it facilitates easy integration into existing 19-inch rack frameworks without requiring complex modifications.
No public confirmed substitute part numbers are available for this specific component.

The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More