316-91-111-41-003000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 316-91-111-41-003000 is an elevated IC socket connector designed for through-hole mounting. It features 11 positions with a 0.100 inch (2.54 mm) pin spacing. The contacts are gold-plated to ensure reliable signal transmission and corrosion resistance. This component belongs to the 316 series of precision-machined interconnects, providing a robust interface between integrated circuits and printed circuit boards.

Headers, Receptacles, Female Sockets Feature Summary

• Elevated design facilitates component clearance and thermal management
• Gold-plated contacts provide durable electrical connections
• Through-hole solder termination ensures secure PCB attachment

Headers, Receptacles, Female Sockets Applications

• Legacy system repair and maintenance
• Test fixture development
• Industrial assembly upgrades requiring socketed components

Headers, Receptacles, Female Sockets Procurement Notes

Verify RoHS compliance status and specific packaging quantities directly with the manufacturer or authorized distributors. Confirm that the ordering suffix matches the required contact plating and terminal style specifications for your application environment.

Headers, Receptacles, Female Sockets Selection Notes

Select this model when an elevated profile is necessary to accommodate taller components or improve airflow around the socketed device. Ensure the board layout supports the 0.100-inch pitch and that through-hole manufacturing processes are available for the selected termination method.

Headers, Receptacles, Female Sockets Part Context

This part is part of the Mill-Max 316 series, which specializes in standard solder tail single-in-line sockets. The series is recognized for high reliability and precision machining, serving as a critical interconnect solution in demanding electronic environments where replaceable ICs are required.

Headers, Receptacles, Female Sockets Replacement Considerations

Direct substitutes must match the 11-position count, 0.100-inch pitch, and elevated form factor. Verify compatibility with existing PCB footprints and ensure equivalent contact material properties to maintain signal integrity and mechanical durability.