316-91-119-41-007000

$12.82

Description：CONN SOCKET 19POS 0.1 GOLD PCB
Series：316
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk

SKU:ab25b8ec379e Category: Headers, Receptacles, Female Sockets Brand: Mill-Max Manufacturing Corp.

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Product introduction

316-91-119-41-007000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN SOCKET 19POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.

Headers, Receptacles, Female Sockets specifications for 316-91-119-41-007000

Description：CONN SOCKET 19POS 0.1 GOLD PCB
Series：316
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk
Connector Type：Elevated Socket
Contact Type：Female Socket
Style：Board to Board
Number of Positions：19
Number of Positions Loaded：All
Pitch - Mating：0.100" (2.54mm)
Number of Rows：1
Row Spacing - Mating：-
Mounting Type：Through Hole
Termination：Solder
Fastening Type：Push-Pull
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：10.0µin (0.25µm)
Insulation Color：Black
Insulation Height：0.402" (10.20mm)
Contact Length - Post：0.118" (3.00mm)
Operating Temperature：-55°C ~ 125°C
Material Flammability Rating：UL94 V-0
Contact Finish - Post：Tin-Lead
Mated Stacking Heights：-
Ingress Protection：-
Features：-
Current Rating (Amps)：3A
Voltage Rating：-

Headers, Receptacles, Female Sockets datasheet and documents for 316-91-119-41-007000

316-91-119-41-007000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 316-91-119-41-007000 is a through-hole IC socket featuring 19 positions with a 2.54mm pitch. It utilizes female headers for connection and supports an operating temperature range of -55°C to +125°C. The connector is designed for surface mounting via plugin terminals and carries a current rating of 3A. Tin-lead plating is applied to the contacts, and the component operates within standard environmental conditions.

Headers, Receptacles, Female Sockets Feature Summary

Elevated contact engagement design positioned above the PCB surface
Through-hole construction for secure board attachment
Tin-lead contact plating for reliable conductivity

Headers, Receptacles, Female Sockets Applications

IC device sockets
Standard solder tail receptacles
Component interconnect sockets

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific tin-lead plating composition against project requirements due to potential RoHS restrictions. Confirm that the elevated socket geometry aligns with the target PCB layout and clearance specifications. Ensure the 3A current rating meets the electrical load demands of the intended application circuit.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when an elevated socket configuration is required to facilitate mating operations above the board plane. The 19-position count suits single in-line package applications. Verify compatibility with the target IC footprint dimensions and ensure the through-hole termination method matches the assembly process capabilities.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Mill-Max 316 series of IC and component sockets. These connectors are engineered for high-reliability interconnect solutions in demanding environments. The series provides standardized pin configurations suitable for various integrated circuit packages and general electronic assembly needs.

Headers, Receptacles, Female Sockets Replacement Considerations

Consult official Mill-Max documentation for direct cross-reference substitutes. Verify mechanical fit and electrical parameters before substituting with generic equivalents.