329-10-108-00-560000

$15.62

Description：CONN HEADER SMD 8POS 2.54MM
Series：329
Mfr：Mill-Max Manufacturing Corp.
Package：Tube

SKU:23dbe7af910f Category: Headers, Male Pins Brand: Mill-Max Manufacturing Corp.

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Product introduction

329-10-108-00-560000 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN HEADER SMD 8POS 2.54MM. Review the specifications below when checking this part for your BOM.

Headers, Male Pins specifications for 329-10-108-00-560000

Description：CONN HEADER SMD 8POS 2.54MM
Series：329
Mfr：Mill-Max Manufacturing Corp.
Package：Tube
Connector Type：Header
Contact Type：Male Pin
Pitch - Mating：0.100" (2.54mm)
Number of Positions：8
Number of Rows：1
Row Spacing - Mating：-
Number of Positions Loaded：All
Style：Board to Board
Shrouding：Unshrouded
Mounting Type：Surface Mount
Termination：Solder
Fastening Type：Push-Pull
Contact Length - Mating：0.121" (3.07mm)
Contact Length - Post：-
Overall Contact Length：0.276" (7.00mm)
Insulation Height：0.110" (2.79mm)
Contact Shape：Circular
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：10.0µin (0.25µm)
Contact Finish - Post：Gold
Contact Material：Brass Alloy
Insulation Material：Thermoplastic
Features：-
Operating Temperature：-
Ingress Protection：-
Material Flammability Rating：-
Insulation Color：Black
Current Rating (Amps)：-
Voltage Rating：-

Headers, Male Pins datasheet and documents for 329-10-108-00-560000

329-10-108-00-560000

Headers, Male Pins Overview

The Mill-Max 329-10-108-00-560000 is a surface mount pin header connector featuring an 8-position configuration with a 0.100 inch (2.54mm) pitch. Designed for board-to-board applications, it utilizes a single-row layout to optimize space on printed circuit boards. The component employs solder cup termination methods and incorporates push-pull fastening mechanisms to ensure secure mating stability. Constructed with copper alloy contacts and PCT insulation, this header provides reliable electrical connectivity in compact electronic assemblies.

Headers, Male Pins Feature Summary

Surface mount design for automated PCB assembly
Single-row eight-position configuration
Solder cup termination method
Push-pull fastening mechanism

Headers, Male Pins Applications

Board-to-board interconnects
Compact electronic assemblies
Automated PCB manufacturing

Headers, Male Pins Procurement Notes

Verify the specific surface mount footprint dimensions against the official datasheet before integration. Confirm that the solder cup termination style aligns with the target PCB pad design. Ensure the single-row eight-position layout meets the spatial constraints of the application. Cross-reference the material specifications to validate compatibility with the assembly process.

Headers, Male Pins Selection Notes

Select this component when a low-profile surface mount solution is required for eight signal lines. The 0.100 inch pitch ensures compatibility with standard board spacing. Consider the single-row geometry for simplified routing compared to dual-row alternatives. Verify that the solder cup termination supports the intended reflow or wave soldering profile.

Headers, Male Pins Part Context

This part belongs to the Mill-Max series of precision interconnect components. It represents a specialized surface mount variant within the broader product line. The manufacturer focuses on high-reliability connectors for demanding industrial and commercial environments. This specific model addresses the need for compact, stable connections in modern electronics.