329-10-132-00-560000

Headers, Male Pins Overview

The Mill-Max 329-10-132-00-560000 is a surface mount pin header connector belonging to the 329 series. It features a double-row configuration with 32 positions and a 0.100-inch (2.54mm) pitch. The component utilizes gold-plated contacts for reliable signal transmission and is designed for board-to-board interconnection applications requiring high-density mounting.

Headers, Male Pins Feature Summary

• Surface mount technology implementation for automated assembly
• Double-row architecture providing high contact density
• Gold-plated contact surfaces ensuring corrosion resistance

Headers, Male Pins Applications

• Board-to-board interconnection systems
• High-density electronic circuit assemblies
• Automated surface mount production lines

Headers, Male Pins Procurement Notes

Verify the specific suffix codes against official Mill-Max documentation to confirm exact plating thickness and termination style. Ensure compatibility with surface mount reflow profiles and check RoHS compliance status through certified datasheets before finalizing procurement specifications.

Headers, Male Pins Selection Notes

Select this component when surface mount topology is required for double-row headers. Confirm that the 2.54mm pitch aligns with the target PCB footprint design. Evaluate mechanical stability requirements against standard surface mount retention capabilities provided by this series.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 329 series of precision-machined interconnect components. The series is characterized by high-reliability connectors designed for demanding electronic environments, offering consistent performance in board-to-board applications within the manufacturer's extensive portfolio.

Headers, Male Pins Replacement Considerations

Cross-reference alternative suppliers for equivalent surface mount double-row headers with matching 2.54mm pitch and 32-position configurations. Verify dimensional tolerances and contact material specifications to ensure functional interchangeability without redesigning the host PCB layout.