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329-13-142-41-540000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 42POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 329-13-142-41-540000 is a single-row interconnect socket designed for solder cup strip applications. It features a .100 inch (2.54mm) pitch and accepts lead diameters ranging from .015 to .025 inches (0.381 to 0.635mm). The component utilizes a gold-plated contact surface with a thickness of 10 microinches over nickel, ensuring reliable conductivity. Constructed with a black insulator rated UL94 V-0, the socket supports a current rating of 3A and operates within a temperature range of -55°C to 125°C.
Verify that the specific suffix matches the required lead acceptance diameter and plating specifications. Confirm the single-row configuration aligns with the target PCB footprint. Ensure the operating temperature range meets the environmental requirements of the final assembly. Cross-reference the UL94 V-0 insulation rating against safety standards applicable to the end product.
Select this component when a solder cup interface is preferred over through-hole or surface mount options. Consider the 3A current rating for power distribution needs. Evaluate the .100 inch pitch compatibility with existing wiring harnesses. Verify that the physical dimensions accommodate the available board space without interference.
This part belongs to the Mill-Max 329 series of interconnect sockets. The series provides various configurations for different termination styles and pin counts. Mill-Max Manufacturing Corp. specializes in high-reliability precision-machined components for electronic interconnect solutions.
Compatible substitutes include other Mill-Max 329 series sockets with matching pitch and termination types. Verify equivalent electrical ratings and physical dimensions before substitution. Check for identical plating thickness and material composition to ensure performance parity.
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