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329-41-138-41-540000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 38POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 329-41-138-41-540000 is a standard socket header featuring 38 positions arranged in a dual-row configuration. It utilizes a 0.100-inch (2.54mm) pin spacing and operates with a board-to-board stacking height of 0.110 inches. The connector employs a push-pull mounting mechanism for secure attachment. Contact surfaces are gold-plated with a thickness of 10 microinches over nickel, while the tail features tin/lead plating at 200 microinches. Designed for through-hole solder cup termination, it supports a current rating of 3A and functions within a temperature range of -55°C to 125°C.
Verify the specific ordering suffix against official Mill-Max documentation to confirm exact plating thickness and material specifications. Ensure compatibility with mating pins regarding diameter and tolerance. Confirm that the push-pull mounting style aligns with the mechanical constraints of the target application environment.
Select this component when a dual-row socket header with a 0.100-inch pitch is required for board-to-board applications. The push-pull feature offers distinct advantages over standard press-fit or solder-only mounts where vibration resistance and ease of assembly are priorities. Verify that the 38-position count matches the design requirements.
This part belongs to the Mill-Max 329 series of standard socket headers. These components are designed for high-reliability applications requiring precision-machined interconnects. The series is characterized by standardized dimensions and robust contact materials suitable for demanding electronic environments.
Consult official Mill-Max cross-reference data for verified substitute part numbers. Generic equivalents may not match the specific push-pull mounting mechanism or gold plating specifications required for this application.
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