SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 34560189 is a side panel designed for the EuropacPRO series. It is specified as a side panel type F with dimensions of 3 U height and 295 mm depth. The component serves as an enclosure accessory for rack-mounted systems, providing lateral coverage and structural integrity to the chassis assembly.
Verify the specific suffix or variant code against the manufacturer's current documentation to ensure compatibility with the intended EuropacPRO chassis model. Confirm that the 295 mm depth matches the system requirements. Check for RoHS compliance status in the latest datasheet before integration into regulated environments.
Select this component when a fixed side panel is required for a 3U high, 295 mm deep EuropacPRO enclosure. Ensure the mounting interface aligns with the specific subrack frame design. Consider thermal management needs if the solid panel restricts airflow compared to vented alternatives.
This part belongs to the nVent SCHROFF EuropacPRO family of modular rack solutions. It functions as a static enclosure component rather than an active electronic device. The product is categorized under rack accessories and mechanical hardware for industrial computing and communication infrastructure.
Cross-reference with other Schroff side panels of identical 3U height and 295 mm depth. Verify mounting hole patterns and material specifications to ensure mechanical interchangeability with existing chassis frames.
Recently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More