SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff part number 34562750 is a mounting plate designed for 19-inch enclosures and subracks. It features a length of 220 mm and a horizontal pitch of 42 HP. The component is manufactured by nVent SCHROFF, a leader in electronics packaging design and fabrication. This specific item serves as hardware for assembling heavy components within standard rack systems.
Verify the exact dimensions against your enclosure specifications before purchase. Confirm that the 42 HP pitch matches your system requirements. Ensure compatibility with the specific Schroff series you are using. Check for any additional mounting hardware included or required separately. Review the datasheet for torque specifications if applicable.
Select this part when heavy components require secure mounting in a 19-inch format. The 42 HP width provides substantial surface area for distribution. Consider the material properties for environmental resistance. Ensure the 220 mm length fits within your available depth constraints. Verify compatibility with existing rack standards.
This component belongs to the nVent SCHROFF range of electronics packaging solutions. Schroff specializes in innovative and high-quality standard products for industrial applications. The product line includes various cases, racks, and accessories designed for robust electronic housing needs.
No public confirmed substitute part numbers are available for this specific component.
The mounting plate has a horizontal pitch of 42 HP.
Yes, it is designed specifically for 19-inch enclosures and subracks.

Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More