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346-44-143-41-012000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 43POS 0.1 TIN PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 346-44-143-41-012000 is a precision-machined IC socket designed for through-hole mounting. It features a single row of contacts with a 0.1-inch (2.54 mm) pitch, accommodating 43 positions. The connector utilizes gold-plated beryllium copper contacts to ensure reliable signal transmission and low contact resistance. The housing is constructed from plastic, providing structural integrity and insulation. This component belongs to the 0346 series, which is engineered for high-reliability applications requiring robust interconnect solutions in electronic assemblies.
Verify that the specific ordering suffix matches the required pin count and termination style. Confirm RoHS compliance status as some variants may differ. Ensure the supplier provides official Mill-Max documentation to validate authenticity. Check for any regional distribution restrictions before finalizing the order.
Select this model when a 43-position, 0.1-inch pitch socket is required. Consider the mechanical retention needs of the target IC package. Evaluate the operating temperature range against application requirements. Compare contact plating thickness if high-cycle durability is critical for the deployment environment.
This component is part of the Mill-Max 0346 series of IC sockets. The series is characterized by its use of machined spring contacts rather than stamped leaves, offering superior performance in high-vibration environments. Mill-Max Manufacturing Corp. produces these components at their US-based facility, ensuring tight tolerances and consistent quality across the product line.
Consult Mill-Max official cross-reference guides for direct substitutes. Verify that alternative sockets match the 43-pin count and 0.1-inch pitch exactly. Ensure mechanical dimensions and contact material specifications are compatible with the existing board layout and thermal requirements.
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