SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 34812108 is an unshielded front panel designed for frame-type plug-in units (PIU). Constructed from aluminum with an anodized finish, it measures 40.3 x 2.5 x 128.4 mm. The component features a 3 HE (High Equivalent) height and 8 TE (Technical Units) width configuration, providing a standardized interface for modular electronic enclosures.
Verify the exact part number 34812108 against manufacturer documentation to confirm compatibility with specific frame types. Ensure the required 3 HE and 8 TE dimensions match your system design. Confirm that the unshielded specification meets your environmental requirements before procurement.
Select this component when a standard aluminum front panel for frame-type PIUs is required. The 3U height and 8HP width define its physical footprint. Consider the anodized finish for basic corrosion resistance in indoor environments where electromagnetic shielding is not necessary for the application.
This item belongs to the nVent Schroff accessories line, specifically categorized as rack accessories. It serves as a structural faceplate for modular plug-in units, allowing for organized installation within industrial or commercial chassis systems without providing signal isolation.
Cross-reference with similar 3U 8TE front panels from the same manufacturer family, such as part numbers 34812110 or 34812112, ensuring identical dimensional constraints and material specifications are maintained for direct interchangeability.

TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
Understand how a comparator switches at a voltage threshold, why hysteresis prevents chatter, and which output and input specs matter.
Read More
Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More