SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 34812812 is a rear panel accessory designed for frame-type plug-in units. It features a 6U height and 12HP width configuration, designated as the S2 type. This component serves as a structural backplane element within modular rack systems, providing mounting support and alignment for rear-facing connections. The unit is constructed to meet RoHS compliance standards and utilizes panel mount installation methods.
Verify the exact part number 34812812 against official nVent SCHROFF documentation to confirm compatibility with specific guide rail systems. Ensure the required 6U by 12HP form factor matches the existing rack infrastructure. Check for any updated datasheets regarding material specifications or environmental ratings prior to procurement.
Select this component only when a rear panel for frame-type units is required. Confirm that the 6U height and 12HP width align with the planned module layout. Verify that the S2 designation corresponds to the necessary interface or structural requirements of the associated plug-in units.
This part belongs to the nVent SCHROFF range of accessories for electronics cabinets and server racks. It complements other hardware kits and extruded panels within the same modular ecosystem, supporting scalable and combinable rack solutions for industrial and embedded applications.

Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More