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350-90-163-00-106000 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN HEADER SMD 63POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Mill-Max 350-90-163-00-106000 is a straight header connector featuring 63 contacts arranged in a single row. It utilizes a 2.54 mm (0.100 inch) terminal pitch and employs a solder termination method for board attachment. The component is designed for through-hole mounting applications within the 0350 series, providing reliable interconnect solutions for electronic assemblies requiring high-density pin configurations.
Verify that the specific part number matches the required 63-position count and single-row layout. Confirm that the straight orientation and solder termination type align with the target PCB design requirements. Ensure compatibility with standard 2.54 mm mating connectors to guarantee proper mechanical fit and electrical continuity during assembly.
Select this component when a single-row header with 63 pins is required. The 2.54 mm pitch ensures compatibility with standard ribbon cables or mating headers. The straight orientation suits applications where vertical space is available. Verify that the solder termination method is compatible with the chosen manufacturing process, such as wave or selective soldering.
This component belongs to the Mill-Max 0350 series of precision interconnect headers. The series is characterized by high-reliability construction suitable for demanding environments. Mill-Max Manufacturing Corp specializes in custom and standard interconnect solutions, emphasizing durability and precise machining for critical electronic applications across various industries.
Direct substitutes must maintain the 63-pin count, single-row layout, and 2.54 mm pitch. Compatible replacements should offer identical straight orientation and solder termination capabilities. Verify that any alternative part meets the same mechanical and electrical specifications to ensure seamless integration without redesigning the host PCB footprint.
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