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387-028-556-812 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 28POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 387-028-556-812 is a dual-edge card edge connector from the 387 Series, designed for vertical through-hole mounting. It features 28 positions with a 0.156-inch (3.96 mm) pitch and accepts board thicknesses of 1.57 mm. The contacts are made of copper alloy with gold plating, ensuring reliable signal transmission. The housing is constructed from thermoplastic polyester in black, rated for operation between -40°C and +105°C.
Verify the specific ordering suffix to confirm contact plating thickness and flange characteristics, as these vary within the 387 series. Confirm that the target printed circuit board thickness matches the 1.57 mm specification to ensure proper mechanical fit. Check RoHS compliance status if environmental regulations apply to the final assembly. Ensure the dual-edge requirement aligns with the design before procurement.
Select this component when a dual-row interface is required for a 1.57 mm thick board. The 0.156 inch pitch dictates the trace spacing on the edge card. Verify that the vertical orientation fits the enclosure constraints. Compare against single-edge variants if only one row of signals is necessary to reduce cost and profile.
This part belongs to the EDAC 387 Series, which provides standardized card edge connectors for various industrial and commercial applications. The series offers multiple position counts and termination styles. The 387-028 variant specifically addresses designs needing 28 connections in a dual-row format, balancing density with standard spacing requirements.
Direct substitutes include other EDAC 387 series parts with identical 28-position dual-edge specifications. Cross-reference the exact flange type and termination style to ensure mechanical compatibility. Generic equivalents may exist but require verification of pitch and board thickness tolerances.
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