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395-106-555-802 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FML 106POS 0.100. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 395-106-555-802 is a standard card edge connector designed for high-density applications. It features 106 positions arranged in a dual-row configuration with a 0.100-inch (2.54mm) contact spacing and 0.200-inch (5.08mm) row spacing. The connector utilizes female contacts with gold plating to ensure reliable signal transmission. It is engineered to accept printed circuit boards with a nominal thickness of 0.062 inches (1.57mm). The unit employs a high-profile insulator body constructed from thermoplastic polyester, providing robust mechanical stability and electrical insulation for demanding industrial environments.
Verify the specific ordering suffix against the manufacturer's current datasheet to confirm exact physical dimensions and termination style. Ensure compatibility with the target PCB thickness of 0.062 inches before integration. Cross-reference the RoHS compliance status with regional regulatory requirements. Confirm that the dual-edge design aligns with the assembly process specifications. Validate that the supplier provides official documentation for traceability purposes.
Select this component when a high-density interconnect solution is required for double-sided edge cards. The 106-position count supports complex signal routing needs. Consider the 0.100-inch pitch for standard board layout compatibility. Evaluate the high-profile housing if additional mechanical protection or alignment is necessary during assembly. Ensure the operating temperature range meets the environmental conditions of the final application.
This part belongs to the EDAC 395 series of standard card edge connectors. The series offers various position counts and configurations to suit different density requirements. The 395-106 variant specifically addresses applications needing extensive I/O connections within a compact footprint. It represents a standardized solution for connecting peripheral boards to main system backplanes or motherboards in modular designs.
No public confirmed substitute part numbers are available in the provided documentation.
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