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410-93-254-61-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 54POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 410-93-254-61-001000 is a precision machined header connector designed for through-hole mounting. It features 54 positions arranged in two rows with a 0.100 inch (2.54mm) pitch. The contacts are gold-plated to ensure reliable signal transmission and corrosion resistance. This component utilizes a vertical orientation and push-pull locking mechanism for secure mating. It is engineered for high-reliability applications requiring stable electrical connections in demanding environments.
Verify the specific manufacturer designation, as this part number may be associated with Preci-Dip or Mill-Max depending on the supply chain source. Confirm that the gold plating thickness and contact material specifications match the required engineering standards for the target application before finalizing procurement orders.
Select this component when a high-density, two-row header with a standard 2.54mm pitch is required. Ensure the board layout accommodates the vertical height and the push-pull locking mechanism's clearance requirements. Verify compatibility with mating receptacles regarding contact length and insulation material ratings.
This connector belongs to the Mill-Max precision interconnect family, known for custom and standard high-reliability solutions. The 410 series specifically denotes a header configuration optimized for through-hole assembly. It serves as a critical interface component in systems where signal integrity and mechanical stability are paramount.
Direct substitutes include other 54-position, 2.54mm pitch headers from manufacturers such as Preci-Dip or Mill-Max. Ensure replacement parts maintain identical row count, pin spacing, and locking mechanism type to guarantee mechanical fit and electrical performance without redesign.
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