415-13-252-41-003000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 415-13-252-41-003000 is a through-hole receptacle connector featuring 52 positions with a 0.100 inch (2.54mm) pin spacing. It utilizes gold-plated contacts for reliable signal transmission and is designed for PCB mounting.

Headers, Receptacles, Female Sockets Feature Summary

• Through-hole mounting configuration
• Gold-plated contact surfaces

Headers, Receptacles, Female Sockets Applications

• General electronic interconnects
• PCB socket applications

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific manufacturer part number against official Mill-Max documentation to confirm current availability and compliance status. Ensure that the ordering suffix matches the required specifications, as variations may exist within the product family. Cross-reference datasheets for precise mechanical dimensions and material composition before finalizing procurement decisions.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a 52-position through-hole receptacle with 0.100-inch spacing is required. The gold plating offers corrosion resistance suitable for standard interconnect environments. Confirm that the board layout accommodates the specific footprint and that the through-hole technology aligns with the manufacturing process capabilities.

Headers, Receptacles, Female Sockets Part Context

This component belongs to the Mill-Max series of precision-machined interconnect components. Mill-Max specializes in high-reliability connectors, including spring-loaded pins and IC sockets, manufactured in the United States to ensure consistent quality and performance standards across their product lines.

Headers, Receptacles, Female Sockets Replacement Considerations

Consult official Mill-Max substitution guides or datasheets to identify compatible alternatives. Verify that any substitute part maintains identical pin count, spacing, and mounting style to ensure mechanical and electrical compatibility without redesigning the host circuit board.