415-93-226-41-001000

$12.62

Description：CONN RCPT 26POS 0.1 GOLD PCB
Series：415
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk

SKU:9d187779ab4c Category: Headers, Receptacles, Female Sockets Brand: Mill-Max Manufacturing Corp.

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Product introduction

415-93-226-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 26POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.

Headers, Receptacles, Female Sockets specifications for 415-93-226-41-001000

Description：CONN RCPT 26POS 0.1 GOLD PCB
Series：415
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk
Connector Type：Receptacle
Contact Type：Female Socket
Style：Board to Board
Number of Positions：26
Number of Positions Loaded：All
Pitch - Mating：0.100" (2.54mm)
Number of Rows：2
Row Spacing - Mating：0.100" (2.54mm)
Mounting Type：Through Hole
Termination：Solder
Fastening Type：Push-Pull
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：30.0µin (0.76µm)
Insulation Color：Black
Insulation Height：0.110" (2.79mm)
Contact Length - Post：0.108" (2.75mm)
Operating Temperature：-55°C ~ 125°C
Material Flammability Rating：UL94 V-0
Contact Finish - Post：Tin-Lead
Mated Stacking Heights：-
Ingress Protection：-
Features：-
Current Rating (Amps)：3A
Voltage Rating：-

Headers, Receptacles, Female Sockets datasheet and documents for 415-93-226-41-001000

415-93-226-41-001000

Headers, Receptacles, Female Sockets Overview

The Mill-Max Manufacturing Corp. model 415-93-226-41-001000 is a single in-line package (SIP) IC socket designed for through-hole mounting. It features 26 positions arranged in a single row with a 0.100-inch (2.54mm) contact spacing. The component utilizes solder tail termination and gold-plated beryllium copper contacts to ensure reliable electrical connections. The housing is constructed from polybutylene terephthalate (PBT), providing durability across an operating temperature range of -55°C to +125°C. This open-frame design facilitates easy insertion and removal of integrated circuits while maintaining structural integrity during thermal cycling.

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