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416-93-264-41-003000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN SOCKET 64POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 416-93-264-41-003000 is a 64-position elevated socket connector designed for single in-line (SIP) applications. It features a standard solder tail termination method and utilizes gold plating for contact surfaces to ensure reliable signal transmission. The component operates with a pin spacing of 0.100 inches (2.54 mm) and incorporates a standoff height of 0.315 inches, facilitating vertical integration within electronic assemblies.
Verify the specific ordering suffixes and manufacturing revisions directly with Mill-Max Manufacturing Corp. or authorized distributors before procurement. Confirm that the gold plating specifications and standoff dimensions align with the target PCB layout requirements. Ensure compliance with relevant environmental regulations applicable to the intended deployment region.
Select this component when a 64-pin SIP socket with elevated mounting is required. The 0.100-inch pitch ensures compatibility with standard DIP/SIP packages. Consider the 0.315-inch standoff height for clearance needs above the circuit board. Verify that the standard solder tail termination method matches the available surface mount or through-hole assembly processes.
This part belongs to the Mill-Max 416 series of IC and component sockets. The series specializes in high-reliability interconnect solutions manufactured since 1971. The 416 designation typically indicates a single in-line socket configuration with standard solder tails, distinguishing it from dual in-line or plugable variants within the broader product catalog.
Direct substitutes must match the 64-position count, 0.100-inch pitch, and 0.315-inch standoff height. Verify that alternative components offer equivalent gold plating thickness and standard solder tail termination. Cross-reference mechanical drawings to ensure footprint compatibility and electrical performance parity.
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