435-90-260-00-160000

Headers, Male Pins Overview

The 435-90-260-00-160000 is a vertical, unshrouded pin header manufactured by Mill-Max Manufacturing Corp. It features 60 positions arranged in two rows with a 2.54 mm terminal pitch. The connector utilizes a through-hole solder termination method for board mounting. This general-purpose component is designed for standard interconnect applications requiring reliable electrical contact.

Headers, Male Pins Feature Summary

• Vertical board mount configuration
• Unshrouded header design
• Through-hole solder termination

Headers, Male Pins Applications

• General purpose circuit board interconnection
• Prototype development boards
• Standard signal routing assemblies

Headers, Male Pins Procurement Notes

Verify the specific manufacturer part number against official Mill-Max documentation to confirm pin count and pitch specifications. Ensure compatibility with mating connectors regarding row configuration and header height. Check for RoHS compliance status if required by project regulations before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a standard 2.54 mm pitch vertical header is required for through-hole assembly. Consider the unshrouded design for space-constrained layouts where shrouds are unnecessary. Verify that the board thickness and soldering process align with the specified termination type for optimal mechanical stability.

Headers, Male Pins Part Context

This part belongs to the Mill-Max standard pin header series, widely used in electronic manufacturing for reliable PCB connections. The 60-position configuration supports high-density wiring needs while maintaining standard spacing. It serves as a fundamental passive interconnect element in various electronic systems.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 60-pin count, 2-row layout, 2.54 mm pitch, and vertical through-hole termination style. Verify identical mechanical dimensions and material specifications to ensure interchangeability without redesigning the printed circuit board footprint.