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450-40-272-00-106000 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN HEADER SMD 72POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Mill-Max 450-40-272-00-106000 is a precision header connector featuring 72 positions arranged in a dual-row configuration. It utilizes a 0.100-inch (2.54mm) pitch for both row and contact spacing, ensuring compatibility with standard board layouts. Designed for surface mount installation, the unit incorporates push-pull fastening to secure mating connections. The contacts are constructed from copper alloy with a tin plating finish, providing reliable conductivity and corrosion resistance. This component belongs to the 450 series of interconnect solutions.
Verify the specific datasheet version for the 450-40-272-00-106000 prior to ordering, as Mill-Max frequently updates specifications. Confirm that the surface mount footprint matches your PCB design requirements. Ensure the push-pull retention style aligns with your assembly process capabilities. Cross-reference the tin plating thickness if environmental conditions require specific durability standards.
Select this model when a high-count, low-profile header is required for surface mounting. The 2.54mm pitch offers a balance between density and manufacturability. Consider the push-pull feature if vibration resistance or easy mating/demating is necessary. Verify that the unshrouded design fits within your enclosure constraints and does not interfere with adjacent components.
This component is part of the Mill-Max 450 series, which specializes in high-reliability, precision-machined interconnects. The series is known for supporting various termination styles and contact counts. Mill-Max Manufacturing Corp. designs these connectors for demanding applications requiring consistent performance and precise dimensional tolerances across diverse industrial sectors.
No officially confirmed substitute part numbers are documented in the provided source material.
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