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450-90-218-00-001000 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN HEADER VERT 18POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Mill-Max 450-90-218-00-001000 is a vertical header connector featuring 18 positions with a 0.100-inch (2.54mm) pin spacing. Designed for through-hole mounting, it utilizes a two-row configuration to accommodate board-to-board interconnections. The contacts are tin-plated and shaped as round pins, providing a mating contact length of 0.166 inches. This component belongs to the 450 series and is currently in active production status.
Verify the specific manufacturer part number against official Mill-Max documentation to ensure compatibility with your design requirements. Confirm that the tin-plated contact finish meets your environmental and conductivity standards. Check current availability status directly with authorized distributors or the manufacturer, as supply levels may fluctuate based on manufacturing schedules.
Select this connector when a low-profile, vertical header is required for 2.54mm pitch applications. Ensure the PCB layout supports through-hole insertion for the specified 18-position footprint. Consider the tin plating for general use cases where gold plating is not strictly necessary for corrosion resistance or high-cycle durability.
This component is part of the Mill-Max 450 series, which specializes in standard pin headers. It serves as a reliable interconnection solution for electronic assemblies requiring fixed, vertical alignment between boards. The series offers various position counts to suit different density requirements while maintaining consistent mechanical dimensions.
Compatible substitutes include other 18-position, 2.54mm pitch vertical headers from Mill-Max, such as the 450-10-218-00-001000 variant. Verify that alternative parts match the through-hole termination style and two-row configuration to ensure mechanical fit.
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