450-90-228-00-001000

Headers, Male Pins Overview

The Mill-Max 450-90-228-00-001000 is a vertical header connector featuring 28 positions with a 0.100-inch (2.54mm) pitch. It utilizes through-hole termination and includes male pin contacts. The component belongs to the 450 series and employs a push-pull fastening mechanism. Contact plating is specified as tin, with a thickness of 200.0µin (5.08µm). The connector supports a single row configuration.

Headers, Male Pins Feature Summary

• Vertical orientation for standard board mounting
• Push-pull retention system for secure mating
• Tin-plated male pin contacts for conductivity

Headers, Male Pins Applications

• General purpose circuit board interconnections
• Industrial control panel wiring
• Test and measurement equipment interfaces

Headers, Male Pins Procurement Notes

Verify the specific contact plating code '90' corresponds to the required tin finish for your application environment. Confirm that the vertical header style and push-pull retention mechanism align with the mechanical constraints of the assembly. Ensure the 28-position count matches the design requirements before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a vertical, through-hole header with push-pull retention is required. The 2.54mm pitch is standard for general electronics. Consider the tin plating for cost-effective applications where gold is not strictly necessary. Verify that the single-row layout fits within the available PCB footprint dimensions.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 450 series of precision interconnect components. The series is known for high-reliability connectors designed for various industrial and commercial applications. The manufacturer specializes in custom and standard precision-machined interconnect solutions.

Headers, Male Pins Replacement Considerations

The model 450-90-228-00-001000 shares identical physical specifications with 450-40-228-00-001000, differing primarily in contact plating. Verify if the alternative plating option meets the environmental and electrical requirements of the specific deployment scenario.