450-90-246-00-106000

Headers, Male Pins Overview

The Mill-Max 450-90-246-00-106000 is a surface-mount pin header featuring 24 positions with a 0.100-inch (2.54mm) pitch. It utilizes a push-pull fastening mechanism and solder termination for secure board attachment. The connector has a contact length of 0.142 inches (3.61mm) for mating and an insulation height designed for standard interconnect applications.

Headers, Male Pins Feature Summary

• Surface mount construction for automated assembly processes
• Push-pull fastening type ensures secure mechanical retention
• Standard 0.100 inch pitch spacing simplifies layout

Headers, Male Pins Applications

• High-power motor control cabinets
• Industrial automation systems
• General electronic interconnect assemblies

Headers, Male Pins Procurement Notes

Verify the specific suffix codes against official Mill-Max documentation to confirm exact physical dimensions and plating specifications. Ensure the selected variant matches the required surface mount profile and contact material properties for the intended operational environment.

Headers, Male Pins Selection Notes

Select this component when a robust, surface-mount header with a 24-position configuration is required. The push-pull feature provides enhanced stability compared to standard press-fit options. Confirm that the 0.142-inch contact length accommodates the mating connector depth within the system enclosure.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 450 series, which specializes in high-reliability precision-machined interconnect components. The series is recognized for its versatility in custom and standard configurations, serving global electronics manufacturing needs with consistent quality standards.

Headers, Male Pins Replacement Considerations

Consult official Mill-Max substitution guides for compatible alternatives. Verify that any replacement maintains identical pitch, position count, and mounting style to ensure mechanical and electrical compatibility without redesigning the PCB footprint.