451-10-238-00-003000

Headers, Male Pins Overview

The Mill-Max Manufacturing Corp. model 451-10-238-00-003000 is a vertical header connector designed for through-hole mounting. It features 38 positions with a 0.100-inch (2.54mm) pitch. The connector utilizes gold-plated contacts to ensure reliable signal transmission and durability in electronic assemblies.

Headers, Male Pins Feature Summary

• Vertical orientation facilitates compact board layout integration
• Through-hole termination method ensures secure mechanical attachment
• Gold contact plating provides corrosion resistance and stable conductivity

Headers, Male Pins Applications

• General purpose electronic circuit interconnections
• Industrial control system board-to-board connections
• Consumer electronics assembly modules

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix against official Mill-Max documentation to confirm exact pin count, plating thickness, and packaging configuration. Ensure compatibility with mating connectors regarding pitch and housing dimensions before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a high-density vertical header is required for through-hole applications. Confirm that the 38-position requirement aligns with circuit design needs and that the 2.54mm pitch matches existing footprint specifications on the target printed circuit board.

Headers, Male Pins Part Context

This part belongs to the Mill-Max standard header series, which offers various configurations for different mounting styles and pin counts. The 451 series specifically addresses vertical mounting needs, providing a robust solution for connecting peripheral devices or expansion boards to main logic circuits.

Headers, Male Pins Replacement Considerations

Consult official Mill-Max cross-reference guides for direct substitutes. Verify that any alternative part maintains identical 38-pin count, 2.54mm pitch, and vertical form factor to ensure mechanical and electrical compatibility without redesigning the PCB footprint.