533133065

Description：CONN HEADER VERT 30POS 2MM
Series：Mi II 53313
Mfr：Molex
Package：Tray

SKU:08801edb15cd Category: Headers, Male Pins Brand: Molex

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Product introduction

533133065 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Molex. Its product description is CONN HEADER VERT 30POS 2MM. Review the specifications below when checking this part for your BOM.

Headers, Male Pins specifications for 533133065

Description：CONN HEADER VERT 30POS 2MM
Series：Mi II 53313
Mfr：Molex
Package：Tray
Connector Type：Header
Contact Type：Male Pin
Pitch - Mating：0.079" (2.00mm)
Number of Positions：30
Number of Rows：2
Row Spacing - Mating：0.098" (2.50mm)
Number of Positions Loaded：All
Style：Board to Cable/Wire
Shrouding：Shrouded - 4 Wall
Mounting Type：Through Hole
Termination：Solder
Fastening Type：Push-Pull
Contact Length - Mating：0.150" (3.81mm)
Contact Length - Post：0.138" (3.50mm)
Overall Contact Length：-
Insulation Height：0.256" (6.50mm)
Contact Shape：Square
Contact Finish - Mating：Tin
Contact Finish Thickness - Mating：78.7µin (2.00µm)
Contact Finish - Post：Tin
Contact Material：Brass
Insulation Material：Polyamide (PA), Nylon
Features：Board Guide
Operating Temperature：-
Ingress Protection：-
Material Flammability Rating：UL94 V-0
Insulation Color：Gray
Current Rating (Amps)：-
Voltage Rating：-

Headers, Male Pins datasheet and documents for 533133065

533133065

Headers, Male Pins Overview

The Molex 53313-3065 is a 30-position connector component designed for dense connectivity applications. It features gold-plated contacts to ensure reliable signal transmission and corrosion resistance. The configuration balances space efficiency with broad connectivity options, making it suitable for compact electronic assemblies requiring high pin counts within a limited footprint.

Headers, Male Pins Feature Summary

Gold-plated contact surfaces for enhanced conductivity
Dense 30-position layout for space optimization
Broad connectivity compatibility

Headers, Male Pins Applications

Compact electronic assemblies
High-density interconnect systems
Signal transmission modules

Headers, Male Pins Procurement Notes

Verify the exact part number suffix against official Molex documentation to confirm specific housing or mating terminal configurations. Ensure compatibility with existing PCB footprints and mating connectors before procurement. Cross-reference datasheets for mechanical dimensions and material specifications to validate fitment in the target application environment.

Headers, Male Pins Selection Notes

Select this component when a high-density 30-position interface is required within constrained spatial limits. Evaluate the gold plating benefits against environmental exposure requirements. Confirm that the connector's mechanical locking and mating forces align with the assembly's structural design and operational stress conditions.

Headers, Male Pins Part Context

This component belongs to Molex's broader portfolio of high-reliability interconnect solutions. It is engineered to meet rigorous industry standards for signal integrity and mechanical durability. The design supports modern electronics trends toward miniaturization while maintaining robust electrical performance characteristics.

Headers, Male Pins Replacement Considerations

Consult official Molex substitution guides for verified alternative part numbers. Generic equivalents may not match the precise dimensional tolerances or contact plating specifications required for reliable operation in this specific 30-position configuration.