SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 60800064 is a tin-plated copper solder strip designed for efficient linking of connections within the same grid and potential. It features wire-wrap pins with a dimension of 1.14 mm, suitable for use with EN 60603 standards. The component has a pitch of 2.54 mm and a current rating of 4 A. Its conductivity dimensions are specified as 0.6 mm x 0.6 mm.
Verify that the required current rating of 4 A meets your specific circuit design requirements. Confirm compatibility with EN 60603 standards if applicable to your system architecture. Ensure the 2.54 mm pitch aligns with your existing grid layout. Check for RoHS compliance documentation if environmental regulations apply to your manufacturing process.
Select this component when a robust, tin-plated copper solution is needed for connecting components at the same potential. The 1.14 mm wire-wrap pins offer a secure mechanical link. Consider the 0.6 mm x 0.6 mm conductivity dimensions for space-constrained applications requiring reliable electrical continuity without excessive bulk.
This part belongs to the nVent SCHROFF range of rack accessories and busbars. It serves as a mounting material for electronic assemblies, facilitating organized and efficient wiring structures within standard rack environments. The product is categorized under solder strips and bus bars for plug connectors.
Publicly confirmed substitute part numbers are not available in the provided source data. Verify pin dimensions and pitch compatibility before considering alternative manufacturers.
It is made from tin-plated copper.
The pitch is 2.54 mm.

Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More