SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TE Connectivity part number 7-1532020-4 is a Micro-D connector component belonging to the MCDR series. It is designed for high-density interconnect applications in demanding environments. The component features a crimp termination method suitable for reliable signal transmission. It is manufactured by TE Connectivity Aerospace, Defense and Marine, ensuring compliance with rigorous industry standards for military and aerospace connectivity solutions.
Verify the specific pin count and gender configuration required for your assembly against the official datasheet. Confirm that the crimp tooling matches the contact specifications. Ensure environmental ratings meet the operational requirements of the target deployment environment before finalizing procurement orders.
Select this component when space constraints require a high pin count in a small form factor. Evaluate the mechanical durability and signal integrity needs of the application. Compare against standard D-Sub connectors to determine if the Micro-D density offers the necessary advantage for the specific system architecture.
This part belongs to the broader Micro-D connector family from TE Connectivity. These connectors are widely utilized in defense and aerospace sectors where reliability under vibration and shock is critical. The MCDR series provides a robust solution for complex electronic systems requiring dense I/O connections.
Check for direct cross-reference part numbers within the same MCDR series. Verify compatibility with existing housing and mating connectors. Ensure that any substitute maintains the same crimp termination style and environmental sealing characteristics.

In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More