SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TE Connectivity Aerospace, Defense and Marine part number 70F2-17-14-1-B is a circular connector component belonging to the BTH series. It is designed for use in aviation, space, military, and marine applications requiring reliable connectivity systems. The specific configuration includes size 17 shell, 14 contact positions, and a 1-B suffix indicating specific mounting or interface characteristics defined by the manufacturer's standard nomenclature for this series.
Verify the exact pinout and mating compatibility with existing harnesses before procurement. Confirm that the 1-B suffix aligns with the required mounting style and environmental sealing specifications for the target application. Ensure compliance with project-specific quality assurance requirements.
Select this component when a circular connector with size 17 shell and 14 contacts is required. Consider the BTH series characteristics for environmental sealing and mechanical durability. Evaluate against alternative sizes if space constraints differ from the current design parameters.
This part belongs to the BTH series of circular connectors manufactured by TE Connectivity Aerospace, Defense and Marine. The series is engineered for critical applications where signal integrity and physical resilience are paramount. The numbering system indicates shell size, contact count, and specific interface variations.
Public confirmed substitute part numbers are not available in the provided documentation. Consult the manufacturer's official cross-reference guides for compatible alternatives.
A digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More