712-13-110-41-001000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 712-13-110-41-001000 is a 10-position IC socket carrier designed for standard solder tail mounting. It features a single row of contacts with a 0.100-inch (2.54 mm) pitch, suitable for through-hole PCB integration. The connector utilizes gold-plated contacts to ensure reliable signal transmission and corrosion resistance. This component serves as an interface between integrated circuits and the printed circuit board, facilitating assembly and potential replacement.

Headers, Receptacles, Female Sockets Feature Summary

• Standard solder tail termination method for secure PCB attachment
• Gold-plated contact surfaces for enhanced conductivity
• Single-row configuration accommodating 10 positions

Headers, Receptacles, Female Sockets Applications

• Through-hole mounting on printed circuit boards
• Interface connections for integrated circuits
• Standard DIP package carrier applications

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific pin count and row configuration against the target PCB footprint before procurement. Confirm that the solder tail termination style matches the intended assembly process. Ensure compatibility with the voltage and current ratings required by the connected integrated circuit. Cross-reference the manufacturer datasheet for precise mechanical dimensions to guarantee proper fit within the enclosure constraints.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a single-row, 10-position socket is required for through-hole integration. Consider the gold plating for environments requiring high reliability. Evaluate the physical space available on the PCB for the solder tail length. Compare against other series if different termination styles or multi-row configurations are needed for higher density requirements.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Mill-Max 712 series of IC and component sockets. These carriers are engineered for standard solder tail applications, providing a robust connection point for DIP packages. The series offers various position counts to accommodate different integrated circuit sizes while maintaining consistent mechanical and electrical standards across the product line.