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712-41-232-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 32POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 712-41-232-41-001000 is a DIP IC socket featuring 32 positions arranged in a dual-in-line configuration. It utilizes a 0.100-inch (2.54mm) pin spacing and a 2.54-inch row spacing to accommodate standard integrated circuits. The component employs a solder tail termination method for through-hole mounting on printed circuit boards. Contact surfaces are finished with gold plating over a copper alloy base to ensure reliable electrical conductivity and corrosion resistance.
Verify the specific contact finish thickness and material composition against the official datasheet before procurement. Confirm that the solder tail dimensions align with your PCB fabrication capabilities. Ensure the selected supplier provides traceable documentation matching the manufacturer's part number to guarantee component authenticity and performance consistency.
Select this component when a robust, high-reliability connection for DIP packages is required. The open-frame design supports various IC heights, while the solder tail option suits automated assembly lines. Evaluate thermal requirements and current ratings to ensure compatibility with the target application's operational parameters and environmental conditions.
This component belongs to the Mill-Max 712 series, which specializes in standard solder tail carriers. These sockets are engineered for applications demanding precise alignment and consistent electrical performance. The series offers versatile options for integrating surface-mount and through-hole technologies within mixed-signal circuit designs.
Consult the official Mill-Max catalog for direct substitutes within the 712 series. Verify that alternative parts maintain identical pin counts, row spacing, and termination styles to ensure mechanical fit and electrical continuity without redesigning the host circuit board.
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